Electronic components and glasses

ABSTRACT

The present disclosure relates to electronic components and glasses comprising an electronic component. The electronic component may include a component body, a first circuit board, a second circuit board, a first microphone element, and a second microphone element. The component body may include a cavity. The first circuit board and the second circuit board may be inclined to each arranged in the cavity. The first microphone element may be arranged on a sidewall, facing the component body, of the first circuit board. The second microphone element may be arranged on a sidewall, facing the component body, of the second circuit board. A first sound conducting hole may be arranged on a sidewall, opposite to the first microphone element, of the component body. The first sound conducting hole may be configured to conduct a sound to the first microphone element. A second sound conducting hole may be arranged on the sidewall, opposite to the first microphone element, of the component body. The second sound conducting hole may be configured to conduct a sound to the second microphone element. The present disclosure may make full use of a space of the electronic component. When the electronic component is applied to an electronic device, it is beneficial to the thinness and lightness of the electronic device.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.17/646,865, filed on Jan. 3, 2022, which is a continuation of U.S.application Ser. No. 17/172,068 (issued as U.S. Pat. No. 11,272,278),filed on Feb. 9, 2021, which is a Continuation of InternationalApplication No. PCT/CN2019/102380, filed on Aug. 24, 2019, which claimspriority of Chinese Patent Application No. 201810975514.7, filed on Aug.24, 2018, the entire contents of each of which are incorporated hereinby reference.

TECHNICAL FIELD

The present disclosure generally relates to a technical field ofelectronic devices, and more particular, to an electronic component andglasses including the electronic component.

BACKGROUND

With the development of technology, people have higher requirements forthe versatility of electronic devices, products, or the like. Whencollecting voice signals, an electronic device with microphones may besusceptible to other noises, such as noises in the surroundingenvironment and sounds of other people's speeches. As a result, themicrophones cannot receive pure voice signals. A dual-microphonetechnique is a noise reduction technique commonly used at present. Byanalyzing signals collected by a dual-microphone, the voice signals andan influence of other noises may be distinguished.

However, in general, the use of the dual-microphone requires theintegration of more electronic components and more complex circuitstructures in an electronic device, which needs to increase a space ofthe electronic device and is difficult to meet the requirements oflightness and thinness for the electronic device.

Therefore, it is necessary to provide an electronic component, anelectronic device, and a method for installation and assembly of theelectronic component and device, so that the electronic device can notonly accommodate the electronic component (e.g., a dual-microphone) andother electronic components in a more efficient manner, but also meetthe requirements of lightness and thinness.

SUMMARY

One aspect of the present disclosure provides an electronic component.The electronic component may include a component body, a first circuitboard, a second circuit board, a first microphone element, and a secondmicrophone element. The component body may include a cavity. The firstcircuit board and the second circuit board may be inclined to eacharranged in the cavity. The first microphone element may be arranged ona sidewall, facing the component body, of the first circuit board. Thesecond microphone element may be arranged on a sidewall, facing thecomponent body, of the second circuit board. A first sound conductinghole may be arranged on a sidewall, opposite to the first microphoneelement, of the component body. The first sound conducting hole may beconfigured to conduct a sound to the first microphone element. A secondsound conducting hole may be arranged on the sidewall, opposite to thefirst microphone element, of the component body. The second soundconducting hole may be configured to conduct a sound to the secondmicrophone element.

In some embodiments, the component body may include a container body anda cover. The container body may be hollow to form the cavity. An openingin flow communication with the cavity may be arranged in the containerbody. The cover may be arranged on the opening and closes the cavity.

In some embodiments, the first circuit board may be arranged facing thecover. The first microphone element may be arranged on a side, facingthe cover, of the first circuit board.

In some embodiments, the first sound conducting hole may be arranged onthe cover.

In some embodiments, the first circuit board may be parallel or inclinedto the cover. The first sound conducting hole may be vertical orinclined to a surface of the cover.

In some embodiments, a central axis of the first sound conducting holemay coincide with a main axis of a sound receiving area of the firstmicrophone element.

In some embodiments, the second circuit board may be arranged facing thecontainer body. The second microphone element may be arranged on a side,facing the container body, of the second circuit board.

In some embodiments, the second sound conducting hole may be arranged ona sidewall, opposite to the cover or the first sound conducting hole, ofthe container body.

In some embodiments, a central axis of the second sound conducting holemay coincide with a main axis of a sound receiving area of the secondmicrophone element.

In some embodiments, the central axis of the second sound conductinghole may coincide with or be parallel to the central axis of the firstsound conducting hole.

In some embodiments, the main axis of the sound receiving area of thesecond microphone element may coincide with or be parallel to the mainaxis of the sound receiving area of the first microphone element.

In some embodiments, the second microphone element may include a boneconductive microphone. The bone conductive microphone may extend out ofthe container body through the second sound conducting hole.

In some embodiments, the cover may include a hard bracket and a softcover integrally molded on a surface of the hard bracket. The hardbracket may be configured to mechanically connect the container body. Amicrophone hole may be arranged on the hard bracket. The soft cover maycover the microphone hole. A first sound barrier may be arranged at aposition, corresponding to the microphone hole, of the soft cover. Thefirst sound barrier may extend toward the inside of the cavity throughthe microphone hole and define a sound conducting channel. One end ofthe sound conducting channel may be communicated with the first soundconducting hole. The first microphone element may be inserted into thesound conducting channel from other end of the sound conducting channel.

In some embodiments, a second sound barrier may be arranged at aposition, corresponding to the second sound conducting hole, of thecontainer body. The second sound barrier may extend toward the inside ofthe cavity through the second sound conducting hole to limit atransmission direction of a sound to the second microphone element.

In some embodiments, an area of the first circuit board may be smallerthan an area of the second circuit board. The opening and the cover maybe arranged in a corresponding strip shape. A size of the first circuitboard along a width direction of the cover may be smaller than a size ofthe second circuit board in a vertical direction of the first circuitboard.

In some embodiments, a switch and a light-emitting element may bearranged on the first circuit board at intervals.

In some embodiments, a main control chip and an antenna may be arrangedon the second circuit board.

In some embodiments, the first circuit board and the second circuitboard may be made of a flexible circuit board or a soft-hard combineddouble-layer circuit board. The flexible circuit board is bent in thecavity to form the first circuit board and the second circuit board. Thesoft-hard combined double-layer circuit board may include a flexibleconnection board and two hard circuit boards respectively connected toboth ends of the flexible connection board. The two hard circuit boardsmay be inclined to each other to form the first circuit board and thesecond circuit board.

Another aspect of the present disclosure may provide an electronicdevice. The electronic device may include a glasses bracket. The glassesbracket may include a glasses frame and two temples. A temple mayinclude a temple body connected to the glasses frame. At least one oftemple bodies of the two temples may include an electronic component. Acontainer body may be at least a part of the temple body.

In some embodiments, the glasses temple may further include a connectorthat is hinged with, through a hinge, an end of the temple body awayfrom the glasses frame. The glasses may further include a boneconductive loudspeaker. The bone conductive loudspeaker may be arrangedon the connector. The connector may be configured to switch the boneconductive loudspeaker, relative to the temple body, between a firstposition and a second position, and attach the bone conductiveloudspeaker on a back of an auricle of a user when the bone conductiveloudspeaker is in the first position.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is further illustrated in terms of exemplaryembodiments. These exemplary embodiments are described in detail withreference to the drawings. The embodiments are not restrictive. In theembodiments, the same number represents the same structure, wherein:

FIG. 1 is a schematic diagram illustrating an overall structure of anelectronic component according to some embodiments of the presentdisclosure;

FIG. 2 is a schematic diagram illustrating an exemplary explodedstructure of an electronic component according to some embodiments ofthe present disclosure;

FIG. 3 is a schematic diagram illustrating an exemplary partialcross-sectional view of an electronic component according to someembodiments of the present disclosure;

FIG. 4 is a schematic diagram illustrating an exemplary enlarged view ofpart A in FIG. 3 according to some embodiments of the presentdisclosure;

FIG. 5 is a schematic diagram illustrating an exemplary cross-sectionalview of an electronic component in an assembled state along A-A axis inFIG. 2 according to some embodiments of the present disclosure;

FIG. 6 is a schematic diagram illustrating an exemplary enlarged view ofpart B in FIG. 5 according to some embodiments of the presentdisclosure;

FIG. 7 is a schematic diagram illustrating an exemplary partialcross-sectional view of an electronic component according to someembodiments of the present disclosure;

FIG. 8 is a schematic diagram illustrating an exemplary cross-sectionalview of an electronic component in an assembled state along B-B axis inFIG. 2 according to some embodiments of the present disclosure;

FIG. 9 is a schematic diagram illustrating an electronic componenthaving a first circuit board and a second circuit board with a differentangle from that of FIG. 8 according to some embodiments of the presentdisclosure;

FIG. 10 is a schematic diagram illustrating an exemplary cross-sectionalview of an electronic component in an assembled state along C-C axis inFIG. 2 according to some embodiments of the present disclosure;

FIG. 11 is a structural diagram illustrating an exemplary state ofglasses according to some embodiments of the present disclosure;

FIG. 12 is a structural diagram illustrating another exemplary state ofglasses according to some embodiments of the present disclosure;

FIG. 13 is a schematic diagram illustrating an exemplary cross-sectionalview of glasses along D-D axis in FIG. 11 according to some embodimentsof the present disclosure;

FIG. 14 is a schematic diagram illustrating an original state of aprotective sleeve of glasses according to some embodiments of thepresent disclosure;

FIG. 15 is a schematic diagram illustrating an exemplary partialcross-sectional view of an original state of a protective sleeve ofglasses according to some embodiments of the present disclosure;

FIG. 16 is a schematic diagram illustrating a bending state of aprotective sleeve of glasses according to some embodiments of thepresent disclosure;

FIG. 17 is a schematic diagram illustrating an exemplary partialcross-sectional view of a bending state of a protective sleeve ofglasses according to some embodiments of the present disclosure;

FIGS. 18-21 are schematic diagrams illustrating related sidewalls ofglasses according to some embodiments of the present disclosure; and

FIGS. 22-23 are schematic diagrams illustrating distances betweenrelated units of glasses according to some embodiments of the presentdisclosure.

DETAILED DESCRIPTION

In order to describe the technical solutions of the embodiments of thepresent disclosure more clearly, a brief introduction of the drawingsreferred to in the description of the embodiments is provided below.Obviously, the drawings in the following description are only someexamples or embodiments of the present disclosure. Those having ordinaryskills in the art, without further creative efforts, may apply thepresent disclosure to other similar scenarios according to thesedrawings. Unless stated otherwise or obvious from the context, the samereference numeral in the drawings refers to the same structure oroperation.

As used in the disclosure and the appended claims, the singular forms“a,” “an,” and “the” include plural referents unless the content clearlydictates otherwise. In general, the terms “comprises,” “comprising,”“includes,” and/or “including” only indicate that the steps and unitsthat have been clearly identified are included, the steps and units donot constitute an exclusive list, and the method or device may alsoinclude other steps or units.

An electronic component in the present disclosure may be applied to anelectronic device. The electronic device may include any electronicdevice that needs to seal the internal structure, such as a mobilephone, a tablet computer, glasses with circuit components, electronicdevices, etc., which may not be limited herein.

FIG. 1 is a schematic diagram illustrating an overall structure of anelectronic component according to some embodiments of the presentdisclosure. FIG. 2 is a schematic diagram illustrating an exemplaryexploded structure of an electronic component according to someembodiments of the present disclosure. FIG. 3 is a schematic diagramillustrating an exemplary partial cross-sectional view of an electroniccomponent according to some embodiments of the present disclosure. FIG.4 is a schematic diagram illustrating an exemplary enlarged view of partA in FIG. 3 according to some embodiments of the present disclosure. Asshown in FIGS. 1-4 , the electronic component may include a componentbody 10. A cavity 111 may be formed inside the component body. As usedherein, the electronic component may include any electronic devices thatmeet different application scenarios or requirements, which may not belimited herein.

The component body 10 may be a structure formed by combining at leasttwo parts or a structure manufactured by an integral molding technique,for example, a structure integrally formed by an integral injectionprocess. A spatial shape of the component body 10 may include a cuboid,a cube, an ellipsoid, a sphere, a cone, and other irregular spatialshapes. A material of the component body 10 may include plastic, silicagel, rubber, plastic, glass, ceramic, alloy, stainless steel, or thelike, or any combination thereof.

The component body 10 may include a container body 11 and a cover 12.The container body 11 may be hollow to form a cavity 111. An opening 112communicating with the cavity 111 may be arranged in the container body11. The cover 12 may be arranged on the opening 112 and close the cavity111. The cavity 111 may be an internal cavity formed by two or morecomponents when assembled together or an internal cavity formedaccording to a shape of the molding during an integral molding processof the component. The cavity 111 may be configured to accommodate aplurality of electronic elements and circuit structures of theelectronic component. The component body 10 may be configured to sealthe cavity 111. The cavity 111 may be completely sealed by the componentbody 10 or jointly sealed by the component body 10 and other accessorieson the component body 10.

The container body 11 may be at least a part of an electronic device.

Specifically, the container body 11 in the above embodiments may be astructure for accommodating, for example, circuit boards, batteries, andelectronic elements in the electronic device. For example, the containerbody 11 may be a whole or a part of a housing of the electronic device.

In addition, the container body 11 may be provided with the cavity 111having the opening 112 for accommodating the circuit boards, thebatteries, the electronic elements, or the like. The opening 112 may bein flow communication with the cavity and serve as a mounting anddismounting passage of the circuit boards, the batteries, the electronicelements, or the like. Specifically, a count (or number) of the opening112 may be one or multiple, which may not be limited herein.

A shape of the cover 12 may be at least partially matched with theopening 112, so that the cover 12 may be arranged on the opening 112 toseal the cavity 111. A material of the cover 12 may be different from orat least partly the same as the container body 11.

In some embodiments, the cover 12 may include a hard bracket 121 and asoft cover 122. The hard bracket 121 may be configured to mechanicallyconnect with the container body 11. The soft cover 122 may be integrallyinjection molded on a surface of the hard bracket 121 to seal the cavity111 after the hard bracket 121 is connected to the container body 11.

Specifically, a material of the hard bracket 121 may be a hard plastic.A material of the soft cover 122 may be a soft silica gel, a rubber, orthe like. A shape of the hard bracket 121 facing the container body 11may match or conform a shape of the opening 112 and be fixed to theopening 112 of the cavity 111 by inserting, buckling, etc., so as to bemechanically connected to the container body 11. However, a gap that iseasily formed at a connection region between the hard bracket 121 andthe container body 11 may reduce sealing performance of the cavity 111.Further, the soft cover 122 may be integrally injection molded to beformed on an outer surface of the hard bracket 121 away from thecontainer body 11, and further cover the connection region between thehard bracket 121 and the container body 11, so as to realize the sealingof the cavity 111.

In the above embodiments, the cover 12 may include the hard bracket 121and the soft cover 122 that are integrally injected on the surface ofthe hard bracket 121. The hard bracket 121 may be mechanically connectedto the container body 11. The soft cover 122 may further seal the cavity111 after the hard bracket 121 is connected to the container body 11.The soft cover 122 may be more conducive to fit the gap between the hardbracket 121 and the container body 11 to further improve the sealing ofthe electronic component, thereby improving the waterproof effect of theelectronic component. And the hard bracket 121 and the soft cover 122may be integrally molded, which can simplify the assembly process of theelectronic component.

In some embodiments, the hard bracket 121 may include an insertionportion 1211 and a covering portion 1212. The covering portion 1212 maybe arranged on the opening 112. The insertion portion 1211 may bearranged on one side of the covering portion 1212 and extend into thecavity 111 along an inner wall of the cavity 111 to fix the coveringportion 1212 on the opening 112.

In some embodiments, the insertion portion 1211 may not be insertedthrough the inner wall of the cavity 111. For example, the cavity 111may be provided with a plug-in portion matching a shape of the insertionportion 1211 of the hard bracket 121, so that the insertion portion 1211may be inserted into the plug-in portion and fix the insertion portion1211 in the cavity 111. For example, the shape of the insertion portion1211 may be a cylinder and the plug-in portion may be a circular ringthat may wrap or surround the cylindrical insertion portion 1211. Aninner diameter of the plug-in portion of the circular ring may beappropriately smaller than an outer diameter of the cylindricalinsertion portion 1211, so that when inserted into the plug-in portion,the insertion portion 1211 and the plug-in portion may have aninterference fit and the hard bracket 121 can be stably connected to thecavity 111. Certainly, other plug-in manners may also be used, as longas the insertion portion 1211 may be inserted into the cavity 111 andfixed with the cavity 111.

Specifically, the covering portion 1212 may be arranged on a side of theinsertion portion 1211 away from the cavity 111 and cover the opening112 after the insertion portion 1211 is inserted into the cavity 111.The covering portion 1212 may be a complete structure, or some holes maybe further arranged thereon to achieve certain functions.

Referring to FIG. 5 , FIG. 5 is a schematic diagram illustrating anexemplary cross-sectional view of the electronic component in anassembled state along A-A axis in FIG. 2 according to some embodimentsof the present disclosure. In some embodiments, the container body 11may include an opening edge 113 configured to define the opening 112.The covering portion 1212 may be pressed on an inner region 1131, closeto the opening 112, of the opening edge 113. The soft cover 122 maycover an outer surface, away from the container body 11, of the coveringportion 1212 and be pressed on an outer region 1132 that is located atthe periphery of the inner region 1131 of the opening edge 113, so as toachieve a seal with the opening edge 113.

The inner region 1131 and the outer region 1132 of the opening edge 113may both belong to the opening edge 113 and may not be other regionsother than the opening edge 113. The inner region 1131 of the openingedge 113 may be a region of the opening edge 113 close to the opening112. The outer region 1132 of the opening edge 113 may be a region ofthe opening edge 113 away from the opening 112.

In some embodiments, the covering portion 1212 of the hard bracket 121may be pressed on the inner region 1131 of the opening edge 113 close tothe opening 112, so that the covering portion 1212 may initially sealthe opening edge 113 first. However, due to the container body 11 andthe hard bracket 121 are made of hard materials, the connection betweenthe container body 11 and the hard bracket 121 and the further coveringof the covering portion 1212 may not achieve a better sealing effect. Agap may be likely to occur between the opening edge 113 and an end ofthe covering portion 1212 that is pressed on the opening edge 113 andaway from the opening 112. The gap may further penetrate the cavity 111,thereby reducing sealing performance. Therefore, in some embodiments,the soft cover 122 may cover an outer surface of the covering portion1212 away from the container body 11 and be further pressed on the outerregion 1132 that is located at the periphery of the inner region 1131 ofthe opening edge 113, so that the gap between the covering portion 1212of the hard bracket 121 and the opening edge 113 may be further covered.Due to the soft cover 122 is made of a soft material, the sealing andwaterproof effect of the electronic component may be further improved.

Referring to FIG. 6 , FIG. 6 is a schematic diagram illustrating anexemplary enlarged view of part B in FIG. 5 according to someembodiments of the present disclosure. In some embodiments, when thecover 12 is buckled, the periphery of the cover 1212 may cover the innerregion 1131 of the opening edge 113 and contact with the inner region1131 of the opening edge 113. The soft cover 122 may be arranged on aside of the covering portion 1212 away from the container body 11, sothat the covering portion 1212 located in the inner region 1131 of theopening edge 113 may be clamped between the inner region 1131 of theopening edge 113 and the soft cover 122. The soft cover 122 may furtherextend in a direction of the covering portion 1212 away from the opening112 and toward a direction of the opening edge 113 until the soft cover122 contacts with the outer region 1132 of the opening edge 113, so thata contact end surface of the covering portion 1212 and the opening edge113 and a contact end surface of the soft cover 122 and the opening edge113 are arranged flush with each other, thereby forming a structure of“the opening edge 113-the cover 1212-the soft cover 122” on the innerregion 1131 of the opening edge 113.

In another application scenario, referring to FIG. 7 , FIG. 7 is aschematic diagram illustrating an exemplary partial cross-sectional viewof an electronic component according to some embodiments of the presentdisclosure. In the application scenario, after extending to contact theouter region 1132 of the opening edge 113, the soft cover 122 mayfurther extend along a region between the covering portion 1212 and theopening edge 113 to the inner region 1131 of the opening edge 113.Assuming that between the inner region 1131 of the opening edge 113 andthe covering portion 1212, the covering portion 1212 may be pressed onthe inner region 1131 of the opening edge 113 to form a structure of“the opening edge 113-the soft cover 122-the covering portion 1212-thesoft cover 122.” In the application scenario, on a basis of covering thecovering portion 1212 of the hard bracket 121, the soft cover 122 mayfurther extend between the hard bracket 121 and the opening edge 113,thereby further improving the sealing effect between the cavity 111 andthe cover 12, and the waterproof effect of the electronic component.

In some embodiments, referring to FIGS. 1-7 , the electronic componentmay further include a circuit component 13 arranged in the cavity 111. Aswitch 1311 may be arranged on the circuit component 13.

Specifically, the circuit component 13 may include a first circuit board131. The switch 1311 may be arranged on an outer side of the firstcircuit board 131 facing the opening 112 of the cavity 111. A count (ornumber) of switches may be one or multiple. When the count of switchesis multiple, the switches may be arranged on the first circuit board 131at intervals.

Correspondingly, a switch hole 1213 corresponding to the switch 1311 maybe arranged on the hard bracket 121. The soft cover 122 may furthercover the switch hole 1213. A pressing portion 1221 may be arranged at aposition corresponding to the switch hole 1213. The pressing portion1221 may extend toward inside of the cavity 111 through the switch hole1213. When a position corresponding to the soft cover 122 is pressed,the pressing portion 1221 may press the switch 1311 on the circuitcomponent 13 to trigger the circuit component 13 to execute a presetfunction.

The pressing portion 1221 arranged on the soft cover 122 may be formedby a side, facing the bracket 121, of the soft cover 122 protrudingtoward the switch hole 1213 and the switch 1311. A shape of the pressingportion 1221 may match or conform the switch hole 1213, so that when theposition corresponding to the soft cover 122 is pressed, the pressingportion 1221 may pass through the switch hole 1213 to the correspondingswitch 1311 on the first circuit board 131. A length of the pressingportion 1221 in a direction toward the switch 1311 may be set so thatthe switch 1311 is not pressed when the position corresponding to thesoft cover 122 is not pressed, but is pressed by the pressing portion1221 when the position corresponding to the soft cover 122 is pressed.

In some embodiments, a position on the soft cover 122 corresponding tothe pressing portion 1221 may further protrude toward a side away fromthe hard bracket 121 to form a pressing portion 1222 with a convex, sothat a user may determine a position of the switch 1311 and trigger thecircuit component 13 to execute the corresponding function by pressingthe corresponding pressing portion 1222.

In some embodiments, the electronic component may include one or moremicrophone components. Further, the electronic component may include adual-microphone component. The dual-microphone component may include afirst microphone component and a second microphone component. The firstmicrophone component may be arranged at a position closer to a mainsound source (e.g., t human mouth). The second microphone component maybe arranged at a position away from the main sound source. The firstmicrophone component may include a first microphone element and acircuit board on which the first microphone element is mounted. Thesecond microphone component may include a second microphone element anda circuit board on which the second microphone element is mounted. Insome embodiments, the first microphone component and the secondmicrophone component may be distributed in the electronic component in aspecific way, so that the main sound source (e.g., the human mouth) maybe located in a direction of the second microphone element pointing tothe first microphone element.

When a user wears the electronic component, due to a distance of thehuman mouth (the main sound source) relative to the first microphonecomponent and the second microphone component is closer than a distanceof other sound sources (e.g., noise sources) in environment relative tothe first microphone component and the second microphone component, thehuman mouth may be considered as a near-field sound source of the firstmicrophone component and the second microphone component. For anear-field sound source, a volume of a sound received by a microphonecomponent may be related to a distance between the microphone componentand the sound source. Due to the first microphone component is closer tothe main sound source, the first microphone component may receive anaudio signal V_(j1) with a larger volume. Due to the second microphonecomponent is farther from the main sound source, the second microphonecomponent may receive an audio signal V_(j2) with a smaller volume,i.e., V_(j1)>V_(j2).

Due to noise sources in the environment are far away from the firstmicrophone component and the second microphone component, a noise sourcemay be considered as a far-field sound source of the first microphonecomponent and the second microphone component. For a far-field soundsource, noise signals received by the first microphone component and thesecond microphone component may be similar in magnitude, i.e.,V_(Y1)≈V_(Y2).

Therefore, a total sound signal received by the first microphonecomponent may be V₁=V_(j1)+V_(Y1) and a total sound signal received bythe second microphone component may be V₂=V_(j2)=V_(Y2). In order toeliminate noises in the received sound signal, a difference processingmay be performed between the total sound signal of the first microphonecomponent and the total sound signal of the second microphone component.The difference processing may be denoted as Equation (1) as follows:

V=V ₂−(V _(j1) −V _(j2))+(V _(Y1) −V _(Y2))≈V _(j1) −V _(j2)  (1).

Further, according to a difference result obtained by Equation (1),combined with distances of the first microphone component and the secondmicrophone component relative to the main sound source, an audio signalactually obtained, from the main sound source, by the first microphonecomponent and/or the second microphone component may be furtherobtained, i.e., V_(j1) or V_(j2).

Therefore, in order to ensure the quality of the audio signal finallyobtained, the difference result obtained in Equation (1) should be madeas large as possible, i.e., V_(j1)>>V_(j2). In some embodiments of thepresent disclosure, the above effect may be achieved in the followingmanners including making an installation position of the firstmicrophone component as close as possible to the main sound source(e.g., a human mouth); making an installation position of the secondmicrophone component as far away as possible from the main sound source(e.g., the human mouth); isolating spaces of two microphone components;setting a sound barrier between the two microphone components. It shouldbe noted that all the manners mentioned above may achieve the effect ofimproving the quality of the audio signal and the manners may be usedalone or in combination.

In some embodiments, in order to make the installation position of thefirst microphone component as close as possible to the main sound source(e.g., the human mouth), a first circuit board 131 on which the firstmicrophone element 1312 is installed may be arranged to extend along afirst direction. In order to make the installation position of thesecond microphone component as far away as possible from the main soundsource (e.g., the human mouth), a second circuit board 132 on which thesecond microphone element 1321 is installed may be arranged to extendalong a second direction. The first direction and the second directionmay be flexibly adjusted to meet the required installation positions ofthe first circuit board 131 and the second circuit board 132. Forexample, the first direction and the second direction may beperpendicular to each other or inclined at any angle. And correspondingsound conducting channels and sound barriers may be set in aninstallation area of each microphone component. For the descriptions forthe specific installations may be found in FIGS. 8-10 and thedescriptions thereof.

In some embodiments, referring to FIG. 8 and FIG. 9 , FIG. 8 is aschematic diagram illustrating an exemplary cross-sectional view of theelectronic component in an assembled state along B-B axis in FIG. 2according to some embodiments of the present disclosure; and FIG. 9 is aschematic diagram of an electronic component having a first circuitboard and a second circuit board with a different angle from that ofFIG. 8 according to some embodiments of the present disclosure. Thefirst circuit board 131 may include a first microphone element 1312.Specifically, the first circuit board 131 may be arranged facing thecover 12. The first microphone element 1312 may be arranged on a side ofthe first circuit board 131 facing the cover 12. For example, the firstmicrophone element 1312 and the switch 1311 in the above embodiments maybe arranged on the first circuit board 131 at intervals. Specifically,the first microphone element 1312 may be configured to receive a soundsignal from outside of the electronic component and convert the soundsignal into an electrical signal for analysis and processing.

Correspondingly, a microphone hole 1214 corresponding to the firstmicrophone element 1312 may be arranged on the hard bracket 121. A firstsound conducting hole 1223 corresponding to the microphone hole 1214 maybe arranged on the soft cover 122. The first sound conducting hole 1223and the first microphone element 1312 may be arranged correspondingly.

Specifically, the first sound conducting hole 1223 may be arranged onthe cover 12. One end of the first sound conducting hole 1223 may beconnected to the microphone hole 1214 on the cover 12 and other end ofthe first sound conducting hole 1223 may face the first microphoneelement 1312, so that a sound conducting distance may be shortened and asound conducting effect may be improved.

Specifically, the first circuit board 131 may face the cover 12 in amanner parallel or inclined to the cover 12. The first sound conductinghole 1223 may be perpendicular or inclined to a surface of the cover 12.

In some embodiments, a depth direction of the opening 112 may bevertical or inclined with respect to a bottom of the container body 11.When the opening 112 is vertical, the cover 12 may be horizontal withrespect to the container body 11 after being closed. When the opening112 is inclined, the closed cover 12 may be inclined with respect to thecontainer body 11. The inclination of the closed cover 12 with respectto the container body 11 may be toward a side of the mouth of a humanbody, which can make the first sound conducting hole 1223 face the humanmouth or the human face more directly, thereby improving the effect ofthe microphone component in collecting sounds of the main sound source.

Further, when the opening 112 is inclined, an angle between a plane ofthe opening 112 and a plane of the container body in a width directionmay be in a range of 10°-30°, so that the first sound conducting hole1223 further faces a mouth area of the human. Specifically, when theopening 112 is inclined, the angle between the plane of the opening 112and the plane of the container body in the width direction may be anyangle within the above range, such as 10°, 15°, 20°, 23°, 27°, 30°,etc., which may not be limited herein.

Specifically, the first sound conducting hole 1223 may be a through holedisposed on the soft cover 122. When the opening 112 is vertical and thefirst circuit board 131 is parallel to the cover 12, the first soundconducting hole 1223 may be perpendicular to the cover 12, that is, thefirst sound conducting hole 1223 may be vertical. When the opening 112is vertical and the first circuit board 131 is inclined to the cover 12,the first sound conducting hole 1223 may be inclined to the cover 12,that is, the first sound conducting hole 1223 may be inclined. When theopening 112 is inclined and the first circuit board 131 is parallel tothe cover 12, the first sound conducting hole 1223 may be perpendicularto the cover 12, that is, the first sound conducting hole 1223 may beinclined. When the opening 112 is inclined and the first circuit board131 is inclined to the cover 12, the first sound conducting hole 1223may also be inclined to the cover 12, that is, the first soundconducting hole 1223 may be vertical or inclined.

Further, when the first circuit board 131 faces the cover 12 andinclines to the cover 12, an angle between the first circuit board 131and a plane that the cover 12 is located may be in a range of 5°-20°.Specifically, when the first circuit board 131 faces the cover 12 andinclines to the cover 12, the angle between the first circuit board 131and the plane that the cover 12 is located may be any angle within theabove range, such as 5°, 8°, 10°, 15°, 20°, etc., which may not belimited herein.

Specifically, the first sound conducting hole 1223 may correspond to themicrophone hole 1214 on the bracket 121 and further connect the firstmicrophone element 1312 with outside of the electronic component, sothat sounds outside the electronic component may be received by thefirst microphone element 1312 through the first sound conducting hole1223 and the microphone hole 1214.

In order to further improve sound conducting effect, a central axis ofthe first sound conducting hole 1223 may coincide with a main axis of asound receiving area 13121 of the first microphone element 1312. Thesound receiving area 13121 of the first microphone element 1312 refersto an area (e.g., a diaphragm) on the first microphone element 1312 thatreceives sound waves. When the central axis of the first soundconducting hole 1223 coincides with the main axis of the sound receivingarea 13121 of the first microphone element 1312, after being collectedby the microphone hole 1214, sounds of the main sound source may bedirectly conducted to the sound receiving area 13121 of the firstmicrophone element 1312 through the first sound conducting hole 1223which further reduces a sound propagation route, avoids loss and echocaused by repeated propagation of the sounds of the main sound source inthe cavity, and prevents the sounds of the main sound source from beingtransmitted to an area that the second microphone element 1321 islocated through a channel in the cavity, thereby improving sound effect.

In some embodiments, the cover 12 may be arranged in a strip shape. Amain axis of the first sound conducting hole 1223 and the main axis ofthe sound receiving area 13121 of the first microphone element 1312 maybe coincided in a width direction of the cover 12. The main axis of thesound receiving area 13121 of the first microphone element 1312 refersto a main axis of the sound receiving area 13121 of the first microphoneelement 1312 in the width direction of the cover 12, such as an axis nin FIG. 8 . The main axis of the first sound conducting hole 1223 may bean axis m in FIG. 8 . The axis n and the axis m may coincide with eachother.

A shape of the first sound conducting hole 1223 may be any shape as longas it may input sounds from outside of the electronic component. In someembodiments, the first sound conducting hole 1223 may be a circular holewith a smaller size that is less than a certain threshold and arrangedin an area of the cover 12 corresponding to the microphone hole 1214.The first sound conducting hole 1223 with the smaller size may reducecommunication between the first microphone element 1312 in theelectronic component and the outside of the electronic component,thereby improving the sealing of the electronic component.

Further, in order to conduct sound signal entering through the firstsound conducting hole 1223 to the first microphone element 1312, a soundconducting channel 12241 may be set in a curved shape.

Specifically, in some embodiments, the main axis of the first soundconducting hole 1223 may be arranged in the middle of the cover 12 inthe width direction of the cover 12.

In some embodiments, a first sound barrier 1224 may be arranged at aposition of the soft cover 122 corresponding to the microphone hole. Thefirst sound barrier 1224 may extend toward the inside of the cavity 111through the microphone hole 1214 and define the sound conducting channel12241. One end of the sound conducting channel 12241 communicates withthe first sound conducting hole 1223 on the soft cover 122. The firstmicrophone element 1312 may be inserted into the sound conductingchannel 12241 from other end of the sound conducting channel 12241.

When the electronic component includes the switch 1311, the switch hole1213 and the microphone hole 1214 may be arranged on the hard bracket121 at intervals.

In some embodiments, a separation distance between the switch hole 1213and the microphone hole 1214 may be 10-20 mm, or may be 10 mm, 15 mm, 20mm, etc.

In some embodiments, the first sound barrier 1224 may extend from thesoft cover 122, through the periphery of the first sound conducting hole1223 and the microphone hole 1214, and into the cavity 111 to theperiphery of the first microphone element 1312, thereby forming thesound conducting channel 12241 from the first sound conducting hole 1223to the first microphone element 1312, so that sound signals of theelectronic component entering the sound conducting hole may directlyreach the first microphone element 1312 through the sound conductingchannel 12241.

In some embodiments, a shape of the sound conducting channel 12241 on asection perpendicular to a length direction of the sound conductingchannel 12241 may be consistent or not consistent with a shape of themicrophone hole 1214 or the first microphone element 1312. In someembodiments, sectional shapes of the microphone hole 1214 and the firstmicrophone element 1312 in a direction perpendicular to the hard bracket121 toward the cavity 111 may be both square. A size of the microphonehole 1214 may be slightly larger than a peripheral dimension of thesound conducting channel 12241. An internal dimension of the soundconducting channel 12241 may be not smaller than a peripheral dimensionof the first microphone element 1312. Accordingly, the sound conductingchannel 12241 may pass through the first sound conducting hole 1223 tothe first microphone element 1312 and wrap around the first microphoneelement 1312.

In the above manner, the soft cover 122 of the electronic component maybe provided with the first sound conducting hole 1223 and the soundconducting channel 12241 that passes through the microphone hole 1214from the periphery of the first sound conducting hole 1223 to reach thefirst microphone element 1312 and is wrapped in the periphery of thefirst microphone element 1312. The sound conducting channel 12241 may bearranged so that the sound signal entering from the first soundconducting hole 1223 can reach the first microphone element 1312 throughthe first sound conducting hole 1223 and be received by the firstmicrophone element 1312, thereby reducing leakage of the sound signal ina propagation process, and improving the efficiency of the electroniccomponent in receiving the sound signal.

In some embodiments, the electronic component may include a waterprooffabric 14 arranged in the sound conducting channel 12241. The waterprooffabric 14 may be butted, by the first microphone element 1312, against aside of the soft cover 122 facing the microphone element and cover thefirst sound conducting hole 1223.

In some embodiments, the hard bracket 121 in the sound conductingchannel 12241 close to the first microphone element 1312 may protrude toform a convex surface opposite to the first microphone element 1312,such that the waterproof fabric 14 may be sandwiched between the firstmicrophone element 1312 and the convex surface or directly bonded to theperiphery of the first microphone element 1312. The specific settingmanner of the waterproof fabric 14 may not be limited herein.

In addition to the waterproof effect of the first microphone element1312, the waterproof fabric 14 may have functions such as soundtransmission, which may avoid adversely affecting the sound receivingeffect of the sound receiving area 13121 of the first microphone element1312.

It should be noted that, due to the need of the circuit component 13itself, the first microphone element 1312 may be arranged at a firstposition of the first circuit board 131. When the first sound conductinghole 1223 is arranged, the first sound conducting hole 1223 may bearranged at a second position of the cover 12 due to requirements suchas beauty, convenience, etc. In some embodiments, the first position andthe second position may not correspond to each other in a widthdirection of the cover 12, so that the main axis of the first soundconducting hole 1223 and the main axis of the sound receiving area 13121of the first microphone element 1312 may be spaced from each other inthe width direction of the cover 12, and the sound input through thefirst sound conducting hole 1223 may not be able to reach the soundreceiving area 13121 of the first microphone element 1312 along astraight line.

In some embodiments, the cover 12 may be a part of the housing of theelectronic device. In order to meet an overall aesthetic requirement ofthe electronic device, the first sound conducting hole 1223 may bearranged in the middle of the cover 12 in the width direction, such thatthe first sound conducting hole 1223 looks more symmetrical and meetsthe visual requirements of people.

In some embodiments, the corresponding sound conducting channel 12241may be set to have a stair shape along the cross-section along B-B axisin FIG. 1 , such that the sound signal introduced by the first soundconducting hole 1223 may be transmitted to the first microphone element1312 through the stair-shaped sound conducting channel 12241 and bereceived by the first microphone element 1312.

In some embodiments, referring to FIG. 10 , FIG. 10 is a schematicdiagram illustrating an exemplary cross-sectional view of the electroniccomponent in an assembled state along C-C axis in FIG. 2 according tosome embodiments of the present disclosure. In some embodiments, theelectronic component may include a light-emitting element 1313.Specifically, the light-emitting element 1313 may be arranged on thefirst circuit board 131 of the circuit component 13 to be accommodatedin the cavity 111. For example, the light-emitting element 1313 may bearranged on the first circuit board 131 in a certain arrangementtogether with the switch 1311 and the first microphone element 1312.

In some embodiments, a light outlet 1215 corresponding to thelight-emitting element 1313 may be arranged on the hard bracket 121. Thesoft cover 122 may cover the light outlet 1215. The thickness of an areaof the soft cover 122 corresponding to the light outlet 1215 may be setto allow lights generated by the light-emitting element 1313 to betransmitted through the soft cover 122.

The light-emitting element 1313 may include a light-emitting diode, etc.In some embodiments, the electronic component may include one or morelight-emitting elements. A count of the light-emitting elements may beone or multiple. In some embodiments, the electronic component mayinclude one or more light outlets. A count of the light outlets on thehard bracket 121 may be the same as the count of the light-emittingelements. When the count of the light-emitting elements is multiple, thelight-emitting elements may correspond to different light outlets, sothat different signals may be transmitted through differentlight-emitting elements.

In some embodiments, the soft cover 122 can still transmit lightsemitted by the light-emitting element 1313 to the outside of theelectronic component by a certain mean while covering the light outlet1215.

Specifically, in some embodiments, the thickness of the soft cover 122corresponding to an entire area or a part of an area of the light outlet1215 may be less than the thickness of the soft cover 122 correspondingto an outer region of the light outlet 1215, such that the lightsemitted by the light-emitting element 1313 may pass through the lightoutlet 1215 and be further transmitted through the soft cover 122. Ofcourse, other manners may also be used to enable the area where the softcover 122 covers the light outlet 1215 to transmit the lights, which isnot specifically limited herein. For example, a window may be arrangedon the soft cover 122 corresponding to the entire area or the part ofthe area of the light outlet 1215. The window may be covered with alayer of a transparent or light-transmitting material (e.g., thin-film,quartz, etc.), such that the lights emitted by the light-emittingelement 1313 may pass through the light outlet 1215 and be furthertransmitted through the window.

In some embodiments, on the basis of covering the light outlet 1215corresponding to the light-emitting element 1313, the soft cover 122 maybe set to enable the lights emitted by the light-emitting element 1313to be transmitted from the soft cover 122 to the outside of theelectronic component. Therefore, the light-emitting element 1313 may besealed by the soft cover 122 without affecting the light-emittingfunction of the electronic component, so as to improve the sealingperformance and waterproof performance of the electronic component.

Specifically, in some embodiments, the hard bracket 121 may be providedwith a light-blocking component 1216 extending toward the inside of thecavity 111 on the periphery of the light outlet 1215. The light-blockingcomponent 1216 may limit a transmission direction of the lightsgenerated by the light-emitting element 1313.

The light outlet 1215 may have any shape that may transmit the lightsemitted by the light-emitting element 1313, such as a circle, a square,a triangle, etc. In some embodiments, the shape of the light outlet 1215may be a circle.

Due to a certain distance exists between the light-emitting element 1313and the light outlet 1215, if no restriction is set, a part of thelights emitted by the light-emitting element 1313 may leak beforereaching the light outlet 1215, so that the lights may not beeffectively propagated to the light outlet 1215, thereby reducing abrightness of the lights visible from the outside of the electroniccomponent and making it inconvenient for a user to receive signals. Thearrangement of the light-blocking component 1216 in the embodiment maylimit the transmission direction of the lights generated by thelight-emitting element 1313, so as to reduce light leakage, therebyincreasing the brightness of the light transmitted through the lightoutlet 1215.

Specifically, in some embodiments, the light-blocking component 1216 maybe partially or completely formed by the hard bracket 121. For example,the hard bracket 121 may extend along the periphery of the light outlet1215 toward the inside of the cavity 111 and surround the light-emittingelement 1313, so that a light channel for light propagation may beformed. Through the light channel, the lights generated by thelight-emitting element 1313 may be directly transmitted to the lightoutlet 1215 along an arrangement direction of the light channel. In someembodiments, the hard bracket 121 may not form the light channel, butonly restrict the propagation of lights from one direction or severaldirections. For example, the hard bracket 121 may extend into the cavity111 from only one side of the light outlet 1215 to form thelight-blocking component 1216 that shields the light-emitting element1313 on one side. In some embodiments, the light-blocking component 1216may cooperate with other components to limit the propagation of lights.For example, the hard bracket 121 may extend into the cavity 111 fromone side of the light exiting hole 1215 to form the light-blockingcomponent 1216 that shields the light-emitting element 1313 on one side.The light blocking-component 1216 may cooperate with an inner wall ofthe cavity 111 or other structures of the hard bracket 121 to limit thetransmission direction of the lights generated by the light-emittingelement 1313 from multiple directions.

In some embodiments, the light-emitting element 1313 and the firstmicrophone element 1312 may be adjacently arranged on the first circuitboard 131. The light outlet 1215 corresponding to the light-emittingelement 1313 and the microphone hole 1214 corresponding to the firstmicrophone element 1312 may be arranged on the hard bracket 121 atintervals. As described in the above embodiments, the first soundbarrier 1224 formed by the soft cover 122 defining the sound conductingchannel 12241 may be arranged on the periphery of the first microphoneelement 1312. The first sound barrier 1224 may be arranged through themicrophone hole 1214, such that the first microphone element 1312 andthe light-emitting element 1313, the microphone hole 1214 and the lightoutlet 1215 are spaced.

Specifically, the light-blocking component 1216 formed by the hardbracket 121 may cooperate with a sidewall of the first sound barrier1224 close to the light-emitting element 1313. The light-blockingcomponent 1216 and the sidewall of the first sound barrier 1224 mayjointly limit the transmission direction of the lights generated by thelight-emitting element 1313.

In some embodiments, the cavity 111 may be arranged in a strip shape ona section perpendicular to a direction of the opening 112.Correspondingly, the hard bracket 121 may be in a strip shape andinserted into the cavity 111 from the opening 112 through the insertionportion 1211, thereby forming a mechanical connection with the cavity111. The insertion portion 1211 may be arranged on both sides of thehard bracket 121 along a length direction of the hard bracket 121, suchthat the light-emitting element 1313 may be provided with thecorresponding insertion portion 1211 of the hard bracket 121 on bothsides of the hard bracket 121 along the length direction of the hardbracket 121 to limit the lights on both sides of the light-emittingelement 1313. In some embodiments, the light-blocking component 1216 maybe arranged on a side of the light-emitting element 1313 perpendicularto the length direction of the hard bracket 121. A sidewall of the firstsound barrier 1224 may be arranged on the other side of thelight-emitting element 1313 perpendicular to the length direction of thehard bracket 121. The sidewall of the first sound barrier 1224 and theother side of the light-emitting element 1313 may be parallel plates andfurther limit the transmission direction of the lights generated by thelight-emitting element 1313 together with the insertion portion 1211 onboth sides of the light-emitting element 1313.

In some embodiments, the circuit component 13 in the electroniccomponent may include the first circuit board 131 in the aboveembodiments and the second circuit board 132. More descriptionsregarding the first circuit board 131 and the second circuit board 132may be found in FIG. 2 , FIG. 5 , FIG. 8 , and FIG. 9 .

Specifically, the second circuit board 132 may be arranged facing thecontainer body 11. The second circuit board 132 may be arranged in thecavity 111 and inclined to the first circuit board 131. A secondmicrophone element may be arranged on a side of the second circuit board132 facing the container body 11.

The second microphone element 1321 may be arranged facing a sidewall ofthe container body 11, such that there is a relatively large space nearthe second microphone element 1321 and it is convenient to providefunctional components corresponding to the second microphone element1321 on the container body 11. In some embodiments, the second circuitboard 132 may be arranged inclined to the first circuit board 131.Functional components on the two circuit boards may be arranged in amisaligned manner, which may reduce distances between the functionalcomponents and further save and compress internal space of theelectronic component.

The second sound conducting hole 114 may be arranged on the sidewall ofthe container body 11 opposite to the cover 12 or the first soundconducting hole 1223.

The second sound conducting hole 114 corresponding to the container body11 may be arranged on the sidewall of the container body 11. The secondsound conducting hole 114 and the first sound conducting hole 1223 maybe away from each other. In some embodiments, the opening 112 of thecontainer body 11 may be an inclined opening. The cover 12 may beinclined with respect to the container body 11. The sidewall of thecontainer body 11 opposite to the first sound conducting hole 1223 maybe a sidewall of the cavity 111. The second sound conducting hole 114may be arranged on the sidewall of the container body 11 within a rangeof 3-6 millimeters from the top of the container body 11. In someembodiments, the distance between the second sound conducting hole 114and the top of the container body 11 may be 3 millimeters, or 4millimeters, or 5 millimeters, or 6 millimeters, etc.

In some embodiments, when a depth direction of the opening 112 of thecontainer body 11 is vertical with respect to the bottom of thecontainer body, the cover 12 may be horizontal with respect to thecontainer body 11. The sidewall of the container body 11 opposite to thefirst sound conducting hole 1223 may be the top of the cavity 111. Thesecond sound conducting hole 114 may be arranged on the top of thecontainer body 11. Further, the second sound conducting hole 114 may bearranged at a middle position of the top of the container body 11.

The above arrangement can keep the second sound conducting hole 114 awayfrom the main sound source, reduce the sound of the main sound sourcereceived by the second sound conducting hole 114, increase a proportionof environmental noise received by the second sound conducting hole 114,and enhance noise reduction effect.

As described in the above embodiments of the electronic component of thepresent disclosure, the first sound conducting hole 1223 correspondingto the first microphone element 1312 and the microphone hole 1214 may bearranged on the cover 12. The first microphone element 1312 may beconfigured to receive sounds input through the sound conducting hole1223. The second microphone element 1321 may be configured to receivesounds input through the second sound conducting hole 114.

In some embodiments, a central axis of the second sound conducting hole114 may coincide with a main axis of a sound receiving area of thesecond microphone element 1321.

When the central axis of the second sound conducting hole 114 coincideswith the main axis of the sound receiving area of the second microphoneelement 1321, noises may be directly conducted to the sound receivingarea of the second microphone element 1321 through the second soundconducting hole 114, which reduces a propagation of noises inside thecavity 111. The noises may be directly conducted to the sound receivingarea 13121 of the first microphone element 1312 through the first soundconducting hole 1223. The noises received by the first microphoneelement 1312 and the noise received by the second microphone element1321 may be approximately the same, which facilitates the elimination ofnoises in subsequent processing and improves the quality of the mainsound source.

In some embodiments, the central axis of the second sound conductinghole 114 may be coincident with or parallel to the central axis of thefirst sound conducting hole 1223.

The second sound conducting hole 114 and the first sound conducting hole1223 may have the same central axis direction, that is, the central axesof the second sound conducting hole 114 and the first sound conductinghole 1223 may coincide or be parallel. In some embodiments, a soundentrance of the second sound conducting hole 114 and a sound entrance ofthe first sound conducting hole 1223 face opposite directions, whichreduces the main sound source received by the second sound conductinghole 114 and is beneficial to eliminate the noises in subsequentprocessing and improve the quality of the main sound source.

In some embodiments, the main axis of the sound receiving area of thesecond microphone element 1321 may coincide with or be parallel to themain axis of the sound receiving area 13121 of the first microphoneelement 1312. The sound receiving area of the second microphone element1321 may receive sound signals from the second sound conducting hole114. The sound receiving area 13121 of the first microphone element 1312may receive sound signals from the first sound conducting hole 1223.Since signals of the main sound source in the second sound conductinghole 114 are small, the signals of the main sound source signal receivedby the sound receiving area of the second microphone element 1321 may besmall, which may improve the quality of audio signals.

In some embodiments, the first circuit board 131 may be arrangedparallel to an opening surface of the opening 112 and close to theopening 112. In some alternative embodiments, the first circuit board131 may be arranged to be inclined to the opening surface of the opening112 and close to the opening 112. In some embodiments, the switch 1311,the light-emitting element 1313, etc., described above may be arrangedon the first circuit board 131. The switch 1311, the light-emittingelement 1313, and the first microphone element 1312, etc., may bearranged on the first circuit board 131 in a certain arrangement manner.Correspondingly, the switch hole 1213, the light outlet 1215, themicrophone hole 1214, etc., may be arranged on the cover 12 at intervalsto transmit signals to the outside of the electronic component throughcorresponding holes.

In some embodiments, the microphone hole 1214 may be arranged at acenter of the cover 12. The switch hole 1213 and the light outlet 1215may be arranged on both sides of the microphone hole 1214 in a lengthdirection of the cover 12, respectively. A distance between the switchhole 1213 and the microphone hole 1214 and a distance between the lightoutlet 1215 and the microphone hole 1214 may be in a range of 5-10millimeters. In some embodiments, the distance between the switch hole1213 and the microphone hole 1214 and/or the distance between the lightoutlet 1215 and the microphone hole 1214 may be 5 millimeters, 6millimeters, 7 millimeters, 8 millimeters, 9 millimeters, 10millimeters, etc. The distance between the switch hole 1213 and themicrophone hole 1214 and the distance between the light outlet 1215 andthe microphone hole 1214 may be the same or different.

In some embodiments, the container body 11 may extend from the opening112 in a direction perpendicular to the opening surface to form thecavity 111 having a certain width. In some embodiments, the secondcircuit board 132 may be arranged parallel to a width direction of thecavity 111 and perpendicular to the opening surface. In some alternativeembodiments, the second circuit board 132 may be arranged to be inclinedto the width direction of the cavity 111 and inclined to the openingsurface of the opening 112. The second circuit board 132 may be arrangedin the cavity 111 and inclined to the first circuit board 131. A maincontrol chip, an antenna, etc., may be arranged on the second circuitboard 132.

In some embodiments, the second circuit board 132 may be arranged to beinclined to the width direction of the cavity 111 and inclined to theopening surface of the opening 112. An angle between the second circuitboard 132 and the width direction of the cavity 111 may be in a range of5°-20°. In some embodiments, the angle between the second circuit board132 and the width direction of the cavity 111 may be any angle withinthe above range, for example, 5°, 10°, 15°, 20°, etc.

In some embodiments, when a user uses the electronic device, the mainaxis of the sound receiving area of the second microphone element 1321may coincide with the main axis of the sound receiving area 13121 of thefirst microphone element 1312. The first microphone element 1312 and thesecond microphone element 1321 may be located at a straight line wherethe mouth of the user is located.

In some embodiments, the first microphone element 1312 and the secondmicrophone element 1321 may be respectively arranged on two circuitboards. The two microphone elements may receive sound signals throughthe first sound conducting hole 1223 and the second sound conductinghole 114, respectively. One of the two microphone elements may beconfigured to collect main sounds such as human voices, and the other ofthe two microphone elements may have a background noise collectionfunction, which facilitates the collection of ambient noises. The twomicrophone elements may cooperate with each other to analyze and processthe received sound signals, which may reduce noises, etc., therebyimproving the processing quality of the sound signal.

In some embodiments, as shown in FIG. 8 and FIG. 9 , FIG. 9 is aschematic diagram of an electronic component having a first circuitboard and a second circuit board with an angle different from that ofFIG. 8 according to some embodiments of the present disclosure. Thefirst circuit board 131 and the second circuit board 132 may be arrangedin the same cavity 111 and inclined to each other, which may make theinstallation of the two circuit boards more flexible. An angle betweenthe two circuit boards may be adjusted according to sizes and positionsof electronic elements on the two circuit boards, which may improve thespace utilization rate of the electronic component. When the abovearrangement is further applied to an electronic device, a space of theelectronic device may be saved, so as to facilitate the thinning of theelectronic device.

In some embodiments, the angle between the first circuit board 131 andthe second circuit board 132 may be in a range of 50° to 150°.Specifically, the angle between the first circuit board 131 and thesecond circuit board 132 may be any angle within the above range, suchas 70°, 80°, 90°, 100°, 110°, etc.

Specifically, in some embodiments, the opening 112 and the cover 12 maybe arranged in a corresponding long strip shape. A shape of the firstcircuit board 131 may match or conform a shape of the opening 112. Awidth di of the first circuit board 131 may be not larger than a size ofthe opening surface along the width direction of the opening 112, suchthat the first circuit board 131 (parallel or inclined to a surfacewhere the opening is located) can be accommodated at a position in thecavity 111 near the opening 112, that is, the first circuit board 131may be arranged in the long strip shape. Correspondingly, the switch1311, the light-emitting element 1313, and the first microphone element1312 may be arranged on the first circuit board 131 at intervals alongthe length direction (i.e., the length direction of the cover 12) of thefirst circuit board 131.

In some embodiments, the second microphone element 1321 may be a boneconductive microphone. The bone conductive microphone may extend out ofthe container body 11 through the second sound conducting hole 114. Thebone conductive microphone may be installed on a sidewall of thecontainer body 11. The sidewall of the container body 11 refers to asidewall that fits and contacts the user's body when the user wears theelectronic component, such that the bone conductive microphone canbetter receive a vibration signal of the main sound source. When theuser wears the electronic device and performs voice input, the secondmicrophone element 1321 may mainly collect the vibration signal of themain sound source and compare the vibration signal with a sound signal(including an audio signal and noises) collected by the first microphoneelement 1312 (air conduction). In some embodiments, the sound signalcollected by the first microphone element 1312 may be optimized based onthe above comparison result to obtain a high-quality audio signal.

In some embodiments, the second sound conducting hole 114 that passesthrough the sidewall of the cavity 111 may be arranged on the componentbody 10. A second sound barrier 115 may be arranged at a positioncorresponding to the second sound conducting hole 114. The second soundbarrier 115 may extend toward the inside of the cavity 111 through thesecond sound conducting hole 114 to limit the transmission direction ofthe sound to the second microphone element 1321.

In some embodiments, the second sound conducting hole 114 correspondingto the second microphone element 1321 may be arranged on the componentbody 10. The second microphone element 1321 may communicate with theoutside via the second sound conducting hole 114 that penetrates thecavity 111, such that the second microphone element 1321 may receivesound signals from the outside.

The second sound barrier 115 may be a hard material or a soft material.For example, the second sound barrier 115 may be formed by the containerbody 11 extending from inside of the cavity 111 along the periphery ofthe second sound conducting hole 114 toward the inside of the cavity 11.In some embodiments, the second sound barrier 115 may be formed by asoft rubber that is integrally injected with the container body 11 andextends into the cavity 111 along the periphery of the second soundconducting hole 114 on the inner side of the cavity 111. In someembodiments, the second sound barrier 115 may extend into the cavity 111along the circumference of the second sound conducting hole 114.Further, the second sound barrier 115 may extend to the secondmicrophone element 1321 and surround the sound receiving area of thesecond microphone element 1321 to form a channel connecting the secondsound conducting hole 114 and the second microphone element 1321, suchthat the sound signal input from the outside into the second soundconducting hole 114 directly passes through the channel and is receivedby the sound receiving area of the second microphone element 1321. Insome embodiments, the second sound barrier 115 may not completelysurround the circumference of the second sound conducting hole 114, butonly extend along one or both sides of the second sound conducting hole114 toward the inside of the cavity 111. In some embodiments, the secondsound barrier 115 may extend to the second microphone element 1321 toconduct the sound input from the second sound conducting hole 114 topropagate to the second microphone element 1321 and be received by thesound receiving area of the second microphone element 1321.

In some embodiments, the first circuit board and the second circuitboard may be made of a flexible circuit board or a soft-hard combineddouble-layer circuit board. For example, the flexible circuit board maybe bent in the cavity to form the first circuit board and the secondcircuit board. As another example, the soft-hard combined double-layercircuit board may include a flexible connecting board and two hardcircuit boards connected to both ends of the flexible connecting board.The two hard circuit boards may be arranged inclined to each other toform the first circuit board and the second circuit board.

The soft-hard combined double-layer circuit board may be a circuit boardincluding areas of different hardness. In some embodiments, both sidesof the soft-hard combined double-layer circuit board may be hard circuitboards with higher hardness. The middle of the soft-hard combineddouble-layer circuit board may be the flexible connecting board withlower hardness. The flexible connecting board may divide the hardcircuit boards into two areas. The two areas may form the first circuitboard 131 and the second circuit board 132, respectively.

In some embodiments, the first circuit board 131 and the second circuitboard 132 may be the same circuit board. The circuit board may be aflexible circuit board and bent in the cavity to adapt to the cavityspace better. After the circuit board is bent, two parts at the two endsof the bend of the circuit board may form the first circuit board 131and the second circuit board 132, respectively. After bending, the firstcircuit board 131 and the second circuit board 132 may be inclined toeach other. The flexible circuit board may make the installation of thecircuit board easier due to its own deformability.

In some embodiments, the first circuit board 131 and the second circuitboard 132 may be the same circuit board. The circuit board may be asoft-hard combined double-layer circuit board and bent in the cavity toadapt to the cavity space better. A bending area of the circuit boardmay be made of a soft material and two sides of the bending area may bemade of a hard material. The two sides of the bending area may form thefirst circuit board 131 and the second circuit board 132, respectively.After bending, the first circuit board 131 and the second circuit board132 may be inclined to each other. Since the soft-hard combined circuitboard has deformability, the circuit board may better adapt to thelimited space in the cavity.

Referring to FIG. 11 and FIG. 12 , FIG. 11 is a structural diagramillustrating an exemplary state of glasses according to some embodimentsof the present disclosure, FIG. 12 is a structural diagram illustratinganother exemplary state of glasses according to some embodiments of thepresent disclosure. Compared with conventional near-sighted glasses,hyperopic glasses, sunglasses, etc., the glasses in FIGS. 11-12 mayinclude circuit structures, electronic components, etc., to make theglasses be an electronic device with other functions.

In some embodiments, the glasses may include a glasses bracket 20. Theglasses bracket 20 may include glasses frame 21 and two temples 22. Atemple 22 may include a temple body 221 connected to the glasses frame21. At least one temple body 221 may include the electronic component asdescribed elsewhere in the present disclosure.

A component body in the electronic component may be the temple body 221or a part of the temple body 221. In some embodiments, a cavity 111 maybe arranged in the temple body 221 for accommodating a circuit component13 corresponding to the electronic component as described elsewhere inthe present disclosure, such that the glasses have functionscorresponding to the circuit component 13.

It should be further pointed out that when the electronic components asdescribed elsewhere in the present disclosure are used in the glasses,the first circuit board 131 and the second circuit board 132 may be botharranged in the cavity 111 of the same temple 22. For example, the firstcircuit board 131 and the second circuit board 132 may be both arrangedin the cavity 111 of a right temple or a left temple. The cover 12, thelight-emitting hole 1215, a button, the first sound conducting hole1223, etc., corresponding to the cover 12 may be all arranged on a sideof the temple body 221 facing an underside of the user's head. Thetemple body 221 facing an upper side of the user's head may besurrounded by a housing of the temple body 221 completely. In someembodiments, the second sound conducting hole 114 may be arranged on anupper side of the temple body 221 facing outside of the user's head.

Other related structures and functions of the electronic component maybe the same as the descriptions of the electronic component as describedelsewhere in the present disclosure. More related details may refer tothe above embodiments of the electronic component in the presentdisclosure, which is not repeated herein.

In some embodiments, the temple 22 may include a connector 23 that ishinged, by a hinge 231, with an end of the temple body 221 away from theglasses frame 21. In some embodiments, the glasses may include afunctional component 30 which is arranged on the connector 23 to realizecorresponding functions by the circuit component 13, etc., in thecomponent body.

In some embodiments, the functional component may be an air conductiveloudspeaker or a bone conductive loudspeaker. For the convenience ofdescription, the functional components may be described by taking a boneconductive loudspeaker 31 as an example. In some embodiments, theconnector 23 may be arranged so that the bone conductive loudspeaker 31may switch between a first position and a second position relative tothe temple body 221. When being in the first position, the boneconductive loudspeaker 31 may be attached to a back of the user'sauricle through an attachment surface 311.

Specifically, the first position of the bone conductive loudspeaker 31relative to the temple body 221 is shown in FIG. 11 and the secondposition relative to the temple body 221 is shown in FIG. 12 .

An auricle may be a part of an outer ear and mainly composed ofcartilage. In some embodiments, when a loudspeaker is attached to a backof the auricle, sounds/vibrations may be transmitted by the cartilage ofthe auricle, which reduces the impact on an ear canal during soundtransmission while improving the sound quality.

Referring to FIG. 13 , FIG. 13 is a schematic diagram illustrating anexemplary cross-sectional view of glasses along D-D axis in FIG. 11according to some embodiments of the present disclosure. In someembodiments, the component body of the temple body 221 may be arrangedon a side of the temple body 221 close to the glasses frame 21. Thetemple body 221 may include a rod-shaped component 2211 that extendsfrom the component body to the connector 23. A weight-reducing groove22111 may be arranged on the rod-shaped component 2211. The soft cover122 may extend outward from the hard bracket 121 to cover and seal theweight-reducing groove 22111.

In some embodiments, the temple body 221 may be divided into two parts.One of the two parts may be arranged close to the glasses frame andother of the two parts may be arranged close to the connector 23. Thecomponent body may be arranged on a side close to the glasses frame toaccommodate the corresponding circuit component 13. The rod-shapedcomponent 2211 close to the connector 23 may be configured to at leastpartially support the user's ear when the user wears the glasses.

The weight-reducing groove 22111 may be arranged inside the temple body221 along an extending direction of the rod-shaped component 2211. Therod-shaped component 2211 may be a partially hollow structure, whichreduces an entire weight of the glasses in a certain extent and improvesan overall elasticity of the rod-shaped component, thereby improvingwearing comfort of the user.

Referring to FIGS. 14-17 , FIG. 14 is a schematic diagram illustratingan original state of a protective sleeve of glasses according to someembodiments of the present disclosure; FIG. 15 is a schematic diagramillustrating an exemplary partial cross-sectional view of an originalstate of a protective sleeve of glasses according to some embodiments ofthe present disclosure; FIG. 16 is a schematic diagram illustrating abending state of a protective sleeve of glasses according to someembodiments of the present disclosure; FIG. 17 is a schematic diagramillustrating an exemplary partial cross-sectional view of a bendingstate of a protective sleeve of glasses according to some embodiments ofthe present disclosure. The glasses may include a protective sleeve 40sheathed on the periphery of the hinge 231. The protective sleeve 40 maybe bent along with the hinge 231 to protect the hinge 231 and preventthe hinge 231 from pinching user's hairs while the user wears theglasses, which may bring a bad experience to the user.

In some embodiments, the protective sleeve may be bent along with thehinge 231 when the bone conductive loudspeaker 31 is switched betweenthe first position and the second position.

In some embodiments, the protective sleeve 40 may include a plurality ofannular ridges 41 arranged at intervals along a length direction of theprotective sleeve 40 and an annular connecting portion 42 arrangedbetween two adjacent annular ridges 41 and configured to connect the twoadjacent annular ridges. A thickness of a tube wall of an annular ridge41 may be larger than a thickness of a tube wall of the annularconnecting portion 42.

The length direction of the protection sleeve 40 may be consistent witha length direction of the hinge 231. The protection sleeve 40 may bearranged along the length direction of the hinge 231. The protectivesleeve 40 may be made of a soft material, such as a soft silica gel, arubber, etc.

An annular ridge 41 may be formed by the outer sidewall of theprotective sleeve 40 protruding outward. A shape of an inner sidewall ofthe protective sleeve 40 corresponding to the plurality of annularridges 41 may be not limited herein. For example, the inner sidewall maybe smooth, or include a sunken that is arranged on the inner sidewallcorresponding to each annular ridge 41.

The annular connecting portion 42 may be configured to connect the twoadjacent annular ridges 41. Specifically, the annular connecting portion42 may be connected to an edge area of the two adjacent annular ridges41 close to the inside of the protective sleeve 40, such that the outersidewall of the protective sleeve 40 may be recessed relative to theannular ridges 41.

In some embodiments, a count of the plurality of annular ridges 41 and acount of the annular connecting portions 42 may be determined accordingto actual usage conditions. For example, the count of the plurality ofannular ridges 41 and the count of the annular connecting portions 42may be determined based on a length of the protective sleeve 40, a widthof each annular convex ridge 41 and a width of each annular connectingportion 42 along a length direction of the protective sleeve 40.

In some embodiments, the thickness of the tube wall of the annular ridge41 may refer to a thickness between the inner and outer sidewalls of theprotective sleeve 40 corresponding to the annular ridge 41. Thethickness of the tube wall of the annular connecting portion 42 mayrefer to a thickness between the inner and outer sidewalls of theprotective sleeve 40 corresponding to the annular connecting portion 42.In some embodiments, the thickness of the tube wall of the annular ridge41 may be larger than the thickness of the tube wall of the annularconnecting portion 42.

As shown in FIG. 16 and FIG. 17 , when the protective sleeve 40 is bentalong with the hinge 231, the annular ridge(s) 41 and the annularconnecting portion(s) 42 may be in a stretched state in an outer regionof the protective sleeve 40 in the bent shape and the annular ridge(s)41 and the annular connecting portion(s) 42 may be in a compressed statein an inner region of the protective sleeve 40 in the bent state.

In the above embodiments, the thickness of the tube wall of the annularridge(s) 41 may be greater than the thickness of the tube wall of theannular connecting portion(s) 42, such that the annular ridge(s) 41 maybe harder than the annular connecting portion(s) 42. Therefore, when theprotective sleeve 40 is in a bent state and the outer region of theprotective sleeve 40 is in a stretched state, the annular ridge(s) 41may provide a certain strength support for the protective sleeve 40.When the inner region of the protective sleeve 40 is in the compressedstate, the annular ridge(s) 41 may withstand a certain compressingforce, thereby protecting the protective sleeve 40, improving thestability of the protective sleeve 40, and extending the life of theprotective sleeve 40.

It should be pointed out that a bending shape of the protective sleeve40 may be consistent with a state of the hinge 231. In some embodiments,the functional component 30 and the temple body 221 may be rotatedwithin a range of less than or equal to 180° through the hinge 231, thatis, the protective sleeve 40 can only be bent toward one side.Therefore, when the glasses are used, one of two sides along a lengthdirection of the protective sleeve 40 may be compressed and other sideof the two sides may be stretched.

In some embodiments, when the protective sleeve 40 is in the bent state,a width of the annular ridge 41 toward the outer side of the bendingshape formed by the protective sleeve 40 along the length direction ofthe protective sleeve 40 may be greater than a width along the lengthdirection of the protective sleeve 40 toward the inner side of thebending shape.

In some embodiments, the increase of the width of the annular ridge 41along the length direction of the protective sleeve 40 may improve thestrength of the protective sleeve. In some embodiments, an initial anglebetween the functional component 30 and the temple body 221 may be lessthan 180°. In such cases, if the annular ridges 41 of the protectivesleeve 40 are uniformly arranged, the protective sleeve 40 may becompressed in the original state. In the above embodiments, when theprotective sleeve 40 is in the bent state, a width of the annular ridge41 facing the outer side of the bending shape may be larger, which mayenlarge the length of the protective sleeve 40 and improve the strengthof the protective sleeve 40, and further reduce, in a certain extent, adegree of the stretching of the protective sleeve 40 on a stretched sideof the protective sleeve 40. In addition, when the protective sleeve 40is in the bent state, a width of the annular ridge 41 facing the innerside of the bending shape along the length direction of the protectivesleeve 40 may be smaller, which may increase a space of the annularconnecting portion 42 in the compressed state along the length directionof the protective sleeve 40, thereby alleviating the compression on thecompression side to a certain extent.

In some embodiments, the width of the annular ridge 41 may graduallydecrease from a side toward the outer region of the bending shape to aside toward the inner region of the bending shape, such that when theprotective sleeve 40 is in a bending shape, the width of the outerregion of the bending shape formed by the protective sleeve 40 may begreater than the width of the inner region of the bending shape.

It should be understood that the annular ridges 41 may be arrangedaround the periphery of the protective sleeve 40. In the lengthdirection of the protective sleeve 40, one side of the annular ridges 41may correspond to a stretched side and the other side of the annularconvex ridges 41 may correspond to a compressed side. In someembodiments, the width of the annular ridges 41 may gradually decreasefrom the side toward the outer region of the bending shape to the sidetoward the inner region of the bending shape, such that the width of theannular ridges 41 changes more uniformly, thereby improving thestability of the protective sleeve 40 to a certain extent.

In some embodiments, when the protective sleeve 40 is in a bendingstate, the annular ridges 41 may be provided with grooves 411 on aninner annular surface of the protective sleeve 40 on the outer region ofthe bending shape formed by the protective sleeve 40.

The grooves 411 may be arranged along a direction perpendicular to thelength direction of the protective sleeve 40, such that the annularridges 41 corresponding the grooves 411 may be properly stretched whenthe protective sleeve 40 is stretched in the length direction.

As described above, when the protective sleeve 40 is in the bent state,the protective sleeve 40 facing the outer region of the bending shapeformed by the protective sleeve 40 may be in the stretched state.Further, the grooves 411 may be arranged on the inner annular surface ofthe protective sleeve 40 corresponding to the annular ridges 41, suchthat when a side of the protective sleeve is stretched corresponding tothe grooves 411, the annular ridges 41 corresponding to the grooves 411may be properly stretched to undertake partial stretching, therebyreducing a tensile force received by the side of the protective sleeveand protecting the protective sleeve 40.

It should be pointed out that when the protective sleeve 40 is in thebent state, the annular ridges 41 facing the inner region of the bendingshape may not be provided with the grooves 41 on the inner sidewall ofthe protective sleeve 40 corresponding to the annular ridges 41. In someembodiments, a width of each groove 41 along the length direction of theprotective sleeve 40 may gradually decrease from the side toward theouter region of the bending shape to the inner region of the bendingshape, such that the grooves 411 may be not arranged on the innersidewall of the protective sleeve 40 corresponding to the annular ridges41 facing the inner region of the bending shape.

In some embodiments, the protective sleeve 40 may be connected with thetemple body 221 and the bone conductive loudspeaker 31 arranged on bothsides in the length direction of the protective sleeve 40, respectively.In some embodiments, the protective sleeve 40 and the soft cover 122 ofthe cover 12 may be integrally formed, thereby making the glasses moreclosed and integrated.

In some embodiments, the functional component may be the bone conductiveloudspeaker 31. The hinge 231 may include a shaft 2311. A vertical planeα of the shaft 2311 of the hinge 231, a symmetry plane β of theconnector 23, and a center point O of an attachment surface 311 of thebone conductive loudspeaker 31 attaching the ear may be in the sameplane or the same relative plane that is in a predetermined error range.

The vertical plane α of the shaft 2311 of the hinge 231 refers to aplane perpendicular to an axial direction of the shaft 2311 of the hinge231 and symmetrically dividing the shaft 2311 of the hinge 231. Moredetails regarding the vertical plane α may refer to FIG. 18 .

The symmetry plane β of the connector 23 refers to a plane that dividesthe connector 23 symmetrically, that is, the connector 23 may bedistributed symmetrically on both sides of the symmetry plane β of theconnector 23. More details regarding the symmetry plane β may refer toFIG. 19 .

The predetermined error range may be obtained based on experience, thematerials and specifications of the connector, and the statistical dataof shapes of ears.

The vertical plane α of the shaft 2311 of the hinge 231, the symmetryplane β of the connector 23, and the center point of the attachmentsurface 311 of the bone conductive loudspeaker 31 may be in the sameplane, which enables the bone conductive loudspeaker 31 connected withthe connector 23 to directly attach the back of the user's auricle. Whenthe connector 23 deforms under a force, a deformation direction of theconnector 23 and a movement direction of the bone conductive loudspeaker31 may be the same and in the plane. Otherwise, when the connector 23deforms under a force, the deformation direction of the connector 23 andthe movement direction of the bone conductive loudspeaker 31 may be notin the same plane, such that the bone conductive loudspeaker 31 may notattach or completely attach the back of a user's auricle due to thetwisting of the connector 23 and the bone conductive loudspeaker 31,thereby resulting in a reduction in the efficiency of sound/vibrationtransmission and reducing the sound quality of the generating device ofthe bone conductive loudspeaker. Certainly, the vertical plane α of theshaft 2311 of the hinge 231, the symmetry plane β of the connector 23,and the center point of the attachment surface 311 of the boneconductive loudspeaker 31 may be in the same relative plane within thepredetermined error range, which may not cause too much influence on theuser during the usage process, but may affect the attaching effect ofthe attachment surface 311 of the bone conductive loudspeaker 31 and theback of the user's auricle to a certain extent.

In some embodiments, when the bone conductive loudspeaker 31 is at thefirst position with respect to the temple body 221, an angle between ahorizontal reference plane γ defined by the tops of the two templebodies 221 and the symmetry plane β of the connector 23 may be 65°-85°.

The horizontal reference plane γ defined by the tops of the two templebodies 221 refers to a plane tangent to the tops of the two templebodies 221. In some embodiments, as shown in FIG. 20 , the horizontalreference plane γ may further be perpendicular to a symmetry plane ofthe glasses frame 21. The symmetry plane β of the connector 23 may bethe same as that shown in FIG. 19 , which may not be repeated herein.

When the bone conductive loudspeaker 31 is at the first r positionrelative to the temple body 221, if the angle between the horizontalreference plane γ defined by the tops of the two temple bodies 221 andthe symmetry plane β of the connector 23 is larger, the bone conductiveloudspeaker 31 may be closer to the outer side of the back of theauricle. If the angle is too large, the bone conductive loudspeaker 31may not even attach to the auricle. If the angle is small, the boneconductive loudspeaker 31 may be too close to the inside of the back ofthe auricle, and even compress the skull of the head, which may reducethe comfort of the user and affect the sound/vibration transmission ofthe bone conductive loudspeaker through the ear cartilage, therebyreducing the sound quality of the bone conductive loudspeaker. When theangle is in a range of 65° to 85°, the bone conductive loudspeaker maybe attached to a relatively moderate position on the back of the user'sauricle.

In addition, when the bone conductive loudspeaker 31 is at the firstposition with respect to the temple body 221, the angle between thehorizontal reference plane γ defined by the tops of the two templebodies 221 and the symmetry plane β of the connector 23 may also be70°-82°, such that the attachment surface 311 of the bone conductiveloudspeaker 31 may be closer to the back area of the auricle directlyopposite to a position of the ear cartilage.

Specifically, when the bone conductive loudspeaker 31 is at the firstposition with respect to the temple body 221, the angle between thehorizontal reference plane γ defined by the tops of the two templebodies 221 and the symmetry plane β of the connector 23 may be any anglewithin the above range, such as 70°, 75°, 80°, 82°, etc., which is notlimited herein.

When the bone conductive loudspeaker 31 is at the first position withrespect to the temple body 221, an angle between a symmetry plane λ ofthe glasses frame 21 and the symmetry plane β of the connector 23 may be5°-30°.

As shown in FIG. 21 , the symmetry plane λ of the glasses frame 21refers to a symmetry plane that divides the glasses frame 21symmetrically. The symmetry plane β of the connector 23 may be the sameas that shown in FIG. 19 , which is not repeated herein.

The angle between the symmetry plane λ of the glasses frame 21 and thesymmetry plane β of the connector 23 may be related to the user's headshape. For example, the angle between the symmetry plane λ of theglasses frame 21 and the symmetry plane β of the connector 23corresponding to the European and American population and the Asianpopulation may be different. When the user wears the glasses, in orderto fix the bone conductive loudspeaker 31 in a suitable position, theuser's ears may support a bottom surface of the temple body 221 and theside surface of the temple body 221 needs to abut against the side ofthe user's head. Therefore, if the angle is large, a front part of thetemple body 221 abuts against the head and a rear part of the templebody 221 may be away from the head. If the angle is large, the frontpart of the temple body 221 may be away from the head and the rear partof the temple body 221 abuts against the head. In both cases, the templebody 221 may not make good contact with the head, which may easily causethe attachment surface 311 of the bone conductive loudspeaker 31 toseparate from the back of the auricle, thereby reducing the soundquality of the bone conductive loudspeaker 31 and making it inconvenientto the usage of the user.

When the bone conductive loudspeaker 31 is at the first position withrespect to the temple body 221, the angle between the symmetry plane λof the glasses frame 21 and the symmetry plane β of the connector 23 maybe 10°-25°. In some embodiments, the angle may also be 10°, 15°, 20°,25°, etc.

As shown in FIG. 22 , a distance h₁ between the center points of theshaft 2311 of the hinge 231 corresponding to the two temples 22 may be90-150 millimeters. This distance h1 may correspond to a left and rightwidth of the user's head.

When the two temples 22 are placed on an upper part of the user's earsand clamped on both sides of the head, if the distance h₁ between thecenter points of the shaft 231 of the hinge 231 corresponding to the twotemples 22 is large, a clamping force of the temples 22 towards theuser's head may be relatively small and a situation of “not tightlyclamped” may occur. As a result, the glasses may easily loosen from theuser's head and the bone conductive loudspeaker 31 may deviate from theposition corresponding to the back of the auricle. However, if thedistance h₁ is small, the temples 22 may clamp the user's head too much,which may cause discomfort to the user.

The distance h₁ between the center points of the shaft 2311 of the hinge231 corresponding to the two temples 22 may be 100-130 mm. In someembodiments, the distance h₁ may also be 100 mm, 110 mm, 120 mm, 130 mm,etc. In some embodiments, different users have different head shapes,which may choose a headset with a more appropriate range of distance h₁.For example, the distance h₁ for male glasses may be in a range of115-130 millimeters and the distance h₁ for female glasses may be in arange of 100-115 millimeters. Certainly, the distance h₁ may be set to amiddle value of the two ranges to suit both male and female at the sametime.

As shown in FIG. 22 , a vertical distance h₂ of a line connecting thesymmetrical center point of the glasses frame 21 and the center point ofthe shafts 2311 of the two hinges 231 may be 105-170 millimeters.

The symmetrical center point of the glasses frame 21 may be a midpointof the nose bridge in the middle of the glasses frame 21. The verticaldistance h₂ may correspond to a front and back length of the user'shead.

If the vertical distance h₂ is large, when the attachment surface 311 ofthe bone conductive loudspeaker 31 is attached to the back of theauricle, the glasses frame 21 may be far away from the user's eyes. Whenthe earphone glasses frame 21 are worn, the attachment surface 311 ofthe bone conductive loudspeaker 31 may not attach properly on the backof the auricle due to it is far away from the back of the auricle. Ifthe vertical distance h₂ is small, when the glasses and earphone areused at the same time, the glasses frame 21 and the bone conductiveloudspeaker 31 clamp the head too tightly at the same time, which causesdiscomfort to the user. When the vertical distance h₂ is too small, itis even difficult to use the glasses and earphone at the same time.

The vertical distance h₂ of the line connecting the symmetrical centerpoint of the glasses frame 21 with the center point of the shafts 2311of the two hinges 231 may also be 130-150 millimeters. Specifically, thevertical distance h₂ may be 130 millimeters, 140 millimeters, 150millimeters, etc. In some embodiments, different user groups maycorrespond to different distance ranges. For example, the verticaldistance h₂ for the male glasses may be in a range of 140˜160millimeters, and the vertical distance h₂ for the female glasses may bein a range of 105˜135 millimeters. Certainly, the vertical distance h₂may be set as a median value of the two ranges to suit both male andfemale at the same time.

As shown in FIG. 22 and FIG. 23 , a ratio (i.e., h₃/h₂) of a distance h₃between the center point of the shaft 2311 of each hinge 231 and thecenter point O of the attachment surface 311 of the corresponding boneconductive loudspeaker 31 and the vertical distance h₂ of the lineconnecting the symmetric center point of the glasses frame 21 with thecenter point of the shafts 2311 of the two hinges 231 the glasses framemay be 0.1-1.5.

The distance h₃ between the center point of the shaft 2311 of each hinge231 and the center point O of the attachment surface 311 of thecorresponding bone conductive loudspeaker 31 may correspond to adistance between the center point of the shaft 2311 of the hinge 231 andan attachment position of the attachment surface 311 and the back of theuser's auricle. The vertical distance h₂ between the symmetrical centerpoint of the glasses frame 21 and the center point of the shafts 2311 ofthe two hinges 231 may correspond to a vertical distance from the frontof the user's head to the back of the ear. When the vertical distancefrom the front of the user's head to the back of the ear is constant, ifthe distance between the center point of the shaft 2311 of the hinge 231and the attachment position of the attachment surface 311 and the backof the user's auricle is relatively large, that is, the above ratio isrelatively large, which indicates that the distance between the centerpoint of the shaft 2311 of the hinge 231 and the center point O of theattachment surface 311 of the corresponding bone conductive loudspeaker31 is relatively large, the bone conductive loudspeaker 31 may be easierto attach to the lower part of the back of the auricle. When the aboveratio is small, which indicates that the distance between the centerpoint of the shaft 2311 of the hinge 231 and the center point O of theattachment surface 311 of the corresponding bone conductive loudspeaker31 is relatively small, the bone conductive loudspeaker 31 may be easierto attach to the upper part of the back of the auricle. Therefore, thesound/vibration transmission efficiency of the bone conductiveloudspeaker 31 may be affected, and the sound quality may be furtheraffected.

In some embodiments, h₃/h₂ may be in a range of 0.125-0.35, such as0.125, 0.15, 0.20, 0.25, 0.30, 0.35, etc. Different ratios may bedesigned according to the different needs of users, which is not limitedherein.

Further, the bone conductive sound loudspeaker of differentspecifications may be set according to the above parameters, such thatthe user may choose according to his/her head shape to satisfy therequirements of the user.

The above are only embodiments of the present disclosure and do notlimit the scope of the present disclosure. Any equivalent structure orprocess transformation made by using the specification and drawings ofthe present disclosure, directly or indirectly applied to other relatedtechnologies in the same way, are included in the protection scope ofthe present disclosure.

The possible beneficial effects of the embodiments of the presentdisclosure may include but are not limited to: (1), the electroniccomponent of the present disclosure may include a component body, afirst circuit board, and a second circuit board, the first circuit boardand the second circuit board being arranged inclined to each other inthe cavity of the container body, the two circuit boards beingrespectively provided with a first microphone element and a secondmicrophone element, correspondingly, a first sound conducting hole and asecond sound conducting hole being respectively arranged on thesidewalls of the cover and the container body, such that the firstmicrophone element and the second microphone element may receive soundsinput from the first sound conducting hole and the second soundconducting hole, respectively, and the arrangement of two microphoneelements may reduce noises; (2) the two circuit boards may be arrangedin the cavity inclined to each other according to a spatial structure ofthe cavity, which makes full use of the space of the electroniccomponents and improves the space utilization rate when the electroniccomponent is applied to an electronic device, which beneficial to thethinness and lightness of the electronic device. It should be noted thatdifferent embodiments may have different beneficial effects. Indifferent embodiments, the possible beneficial effects may include anyone or more combinations of the above described beneficial effects, orany other potential beneficial effects.

Having thus described the basic concepts, it may be rather apparent tothose skilled in the art after reading this detailed disclosure that theforegoing detailed disclosure is intended to be presented by way ofexample only and is not limiting. Various alterations, improvements, andmodifications may occur and are intended to those skilled in the art,though not expressly stated herein. These alterations, improvements, andmodifications are intended to be suggested by this disclosure, and arewithin the spirit and scope of the exemplary embodiments of thisdisclosure.

Moreover, certain terminology has been used to describe embodiments ofthe present disclosure. For example, the terms “one embodiment,” “anembodiment,” and/or “some embodiments” mean that a particular feature,structure or characteristic described in connection with the embodimentis included in at least one embodiment of the present disclosure.Therefore, it is emphasized and should be appreciated that two or morereferences to “an embodiment” or “one embodiment” or “an alternativeembodiment” in various portions of this specification are notnecessarily all referring to the same embodiment. Furthermore, theparticular features, structures or characteristics may be combined assuitable in one or more embodiments of the present disclosure.

Similarly, it should be appreciated that in the foregoing description ofembodiments of the present disclosure, various features are sometimesgrouped together in a single embodiment, figure, or description thereoffor the purpose of streamlining the disclosure aiding in theunderstanding of one or more of the various inventive embodiments. Thismethod of disclosure, however, is not to be interpreted as reflecting anintention that the claimed subject matter requires more features thanare expressly recited in each claim. Rather, inventive embodiments liein less than all features of a single foregoing disclosed embodiment.

In some embodiments, the numbers expressing quantities or propertiesused to describe and claim certain embodiments of the application are tobe understood as being modified in some instances by the term “about,”“approximate,” or “substantially.” For example, “about,” “approximate,”or “substantially” may indicate ±20% variation of the value itdescribes, unless otherwise stated. Accordingly, in some embodiments,the numerical parameters set forth in the written description andattached claims are approximations that may vary depending upon thedesired properties sought to be obtained by a particular embodiment. Insome embodiments, the numerical parameters should be construed in lightof the number of reported significant digits and by applying ordinaryrounding techniques. Notwithstanding that the numerical ranges andparameters setting forth the broad scope of some embodiments of theapplication are approximations, the numerical values set forth in thespecific examples are reported as precisely as practicable.

Each of the patents, patent applications, publications of patentapplications, and other material, such as articles, books,specifications, publications, documents, things, and/or the like,referenced herein is hereby incorporated herein by this reference in itsentirety for all purposes, excepting any prosecution file historyassociated with same, any of same that is inconsistent with or inconflict with the present document, or any of same that may have alimiting affect as to the broadest scope of the claims now or laterassociated with the present document. By way of example, should there beany inconsistency or conflict between the descriptions, definition,and/or the use of a term associated with any of the incorporatedmaterial and that associated with the present document, the description,definition, and/or the use of the term in the present document shallprevail.

In closing, it is to be understood that the embodiments of theapplication disclosed herein are illustrative of the principles of theembodiments of the application. Other modifications that may be employedmay be within the scope of the application. Thus, by way of example, butnot of limitation, alternative configurations of the embodiments of theapplication may be utilized in accordance with the teachings herein.Accordingly, embodiments of the present application are not limited tothat precisely as shown and described.

1-20. (canceled)
 21. An electronic component, comprising: a componentbody including a container body and a cover, the container body beinghollow to form a cavity, an opening in flow communication with thecavity is arranged in the container body, the cover being arranged onthe opening and closes the cavity; a first microphone element arrangedin the cavity; a second microphone element arranged in the cavity; afirst sound conducting hole arranged on a first sidewall of thecomponent body and configured to conduct a first sound originating froma sound source to the first microphone element; and a second soundconducting hole arranged on a second sidewall of the component body andconfigured to conduct a second sound originating from the sound sourceto the second microphone element.
 22. The electronic component of claim21, wherein the second microphone element is arranged at a positionfarther from the sound source than the first microphone element.
 23. Theelectronic component of claim 21, wherein the first sound conductinghole is arranged on the cover and vertical or inclined to a surface ofthe cover.
 24. The electronic component of claim 21, wherein the secondsound conducting hole is arranged on a sidewall, opposite to the coveror the first sound conducting hole, of the container body.
 25. Theelectronic component of claim 21, wherein the electronic componentfurther includes: a first circuit board; and a second circuit board, thefirst circuit board and the second circuit board being inclined to eachother and arranged in the cavity.
 26. The electronic component of claim25, wherein the first microphone element is arranged on a sidewall,facing the component body, of the first circuit board, and the secondmicrophone element is arranged on a sidewall, facing the component body,of the second circuit board.
 27. The electronic component of claim 26,wherein the first circuit board is arranged facing the cover andparallel or inclined to the cover, the first microphone element beingarranged on a side, facing the cover, of the first circuit board. 28.The electronic component of claim 26, wherein the second circuit boardis arranged facing the container body, the second microphone elementbeing arranged on a side, facing the container body, of the secondcircuit board.
 29. The electronic component of claim 25, wherein an areaof the first circuit board is smaller than an area of the second circuitboard, and the opening and the cover are arranged in a correspondingstrip shape, a size of the first circuit board along a width directionof the cover being smaller than a size of the second circuit board alonga vertical direction of the first circuit board.
 30. The electroniccomponent of claim 25, wherein the first circuit board and the secondcircuit board are made of a flexible circuit board or a soft-hardcombined double-layer circuit board, wherein: the flexible circuit boardis bent in the cavity to form the first circuit board and the secondcircuit board; or the soft-hard combined double-layer circuit boardincludes a flexible connection board and two hard circuit boardsrespectively connected to both ends of the flexible connection board,the two hard circuit boards being inclined to each other to form thefirst circuit board and the second circuit board.
 31. The electroniccomponent of claim 25, wherein a switch and a light-emitting element arearranged on the first circuit board at intervals, or a main control chipand an antenna are arranged on the second circuit board.
 32. Theelectronic component of claim 21, wherein the cover includes a hardbracket and a soft cover integrally molded on a surface of the hardbracket, wherein: the hard bracket is configured to mechanically connectthe container body, a microphone hole is arranged on the hard bracket,the soft cover covers the microphone hole, a first sound barrier isarranged at a position, corresponding to the microphone hole, of thesoft cover, the first sound barrier extends toward inside of the cavitythrough the microphone hole and defines a sound conducting channel, oneend of the sound conducting channel is communicated with the first soundconducting hole, and the first microphone element is inserted into thesound conducting channel from the other end of the sound conductingchannel.
 33. The electronic component of claim 32, wherein: a secondsound barrier is arranged at a position, corresponding to the secondsound conducting hole, of the container body, and the second soundbarrier extends toward the inside of the cavity through the second soundconducting hole to limit a transmission direction of a sound to thesecond microphone element.
 34. The electronic component of claim 21,wherein the second microphone element includes a bone conductivemicrophone, the bone conductive microphone extending out of thecomponent body through the second sound conducting hole.
 35. Theelectronic component of claim 21, wherein a central axis of the firstsound conducting hole coincides with a main axis of a sound receivingarea of the first microphone element.
 36. The electronic component ofclaim 21, wherein a central axis of the second sound conducting holecoincides with a main axis of a sound receiving area of the secondmicrophone element.
 37. The electronic component of claim 21, wherein acentral axis of the second sound conducting hole coincides with or isparallel to a central axis of the first sound conducting hole.
 38. Theelectronic component of claim 21, wherein a main axis of a soundreceiving area of the second microphone element coincides with or isparallel to a main axis of a sound receiving area of the firstmicrophone element.
 39. An electronic device, comprising: a glassesbracket, wherein the glasses bracket includes a glasses frame and twotemples, each of the two temples including a temple body connected tothe glasses frame, at least one of temple bodies of the two templesincluding an electronic component, the electronic component including: acomponent body including a container body and a cover, the containerbody being hollow to form a cavity, an opening in flow communicationwith the cavity is arranged in the container body, the cover beingarranged on the opening and closes the cavity; a first microphoneelement arranged in the cavity; a second microphone element arranged inthe cavity; a first sound conducting hole arranged on a first sidewallof the component body and configured to conduct a first soundoriginating from the sound source to the first microphone element; and asecond sound conducting hole arranged on a second sidewall of thecomponent body and configured to conduct a second sound originating fromthe sound source to the second microphone element.
 40. The electronicdevice of claim 39, wherein the each of the two temples further includesa connector that is hinged with, through a hinge, an end of the templebody away from the glasses frame; the glasses further include a boneconductive loudspeaker, the bone conductive loudspeaker being arrangedon the connector, wherein: the connector is configured to switch thebone conductive loudspeaker, relative to the temple body, between afirst position and a second position, and attach the bone conductiveloudspeaker on a back of an auricle of a user when the bone conductiveloudspeaker is in the first position.